Unbalanced regional economic growth and inter regional economic disparities in China

1、

Development of Inter-car Damper Applied to High-speed Train

高速列车车端减振装置的研制

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2、

Inspiration from the Evolution of the Inter-national Gas Market

国外天然气市场发展给我们的启示

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3、

Prediction and Analysis on Electric Price of Grid Inter region

互联电网地区电价的预测与分析

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4、

A Structure-Conduct-Performance Analysis of Inter-bank Bond Market

银行间债券市场的SCP分析

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5、

Perfecting the inter government structure, building the present company system;

完善内部治理结构，构建现代公司制；

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6、

A practical approach for inter-regional bilateral contracts congestion management

区域电力市场双边交易阻塞管理实用计算方法

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7、

On Strengthening the Management of Tuition and Miscellaneous Fees in Colleges and Universities

浅谈高校学生收费工作的管理关于强化高校学生收费管理的思考

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8、

Initial fee is not charged Do not collect training fees, do not charge annual management fee is not charged other miscellaneous fees.

不收取加盟费，不收取培训费，不收管理年费，不收取其它杂费用。

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9、

Based on a survey of360 kindergartens nearly half of those in the SAR the council found that parents of kindergarten children paid an average of$ 2, 930 in miscellaneous fees a year.

消委会调查了全港近一半（360间）幼儿园，发现幼儿园平均每年向每个学生收取2930元杂费。

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10、

With the development of PIC ( Power Integrate Circuit), we request more for the performance of Power Devices.

随着现代功率集成电路的发展，对功率器件的性能提出了更高要求。

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11、

Mixed-Signal integrate Circuit technology

混合信号集成电路技术

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12、

The copper alloy strip of lead frame is the fundamental material for integrate circuit.

引线框架用铜带是集成电路的重要基础材料。

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13、

The motion controller went through discrete electric component, integrate circuit and software control development processes.

运动控制器历经了分立电子元件、集成电路到软件控制发展阶段。

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14、

Study on the Development of Integrate Circuit ( IC) Industry in China Based on Value Chain Analysis

基于价值链的中国集成电路产业发展对策

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15、

Low Temperature Application Research of the Focal Plane Array Read-out Integrate Circuit

焦平面读出电路设计中的低温应用研究

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16、

With the development of "scaling" in Integrate Circuit, the critical dimension reduces continuously.

随着集成电路按比例缩小趋势的不断发展，刻线临界尺寸不断减小。

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17、

The Development and Heat Dispersion Problem in Integrate Circuit Packaging

集成电路封装高密度化与散热问题

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18、

Parameter Extracting of Interconnection Line and Via in High-speed Integrate Circuit

高速集成电路中互连线与Via结构的参数提取

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19、

Study on Fixed-abrasive Chemical-mechanical Polishing Technology of Wafer in Integrate Circuit Manufacturing

集成电路制造中的固结磨料化学机械抛光技术研究

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20、

Design of Integrate Circuit Coding and Decoding Multi-path Wireless Remote Controller

集成电路编译码多路无线电遥控器的设计

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