温度的例句大全

The calculation method of the enamel glaze baking temperature

搪瓷烧成温度计算方法

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Effects of Baking Temperature on Microstructures and Electric Properties of LaNiO_3 Thin Films

烘烤温度对LaNiO3薄膜微结构与电学性能的影响

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By many years experiences, controlling ballast resistance and excessive compressive temperature force of the rail is recognized as the only means to overcome the track buckling.

多年来认为控制道床阻力及钢轨内的温度力是防止胀轨跑道的主要办法。

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Study on the Distribution of Longitudinal Temperature Stress along Welded Continuous Rail on the Solid Ballast

整体道床无缝轨道纵向温度力分布规律研究

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In this paper, a new model based on a track on the solid ballast for analyzing the longitudinal temperature stress distribution of welded continuous track is presented.

以整体道床上的新型轨道为基础，提出了一种用于计算此类轨道纵向温度力分布的新模型&轨道爬行。

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Recommends the control scheme by monitoring the return water temperature.

推荐采用热水回水温度控制方案。

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Study on effect of brazing temperature on wear properties of brazed WC coatings

钎焊温度对WC金属布钎焊耐磨层性能研究

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The basic principle of Wafer bonder is to require bonding material applied a series of external conditions, such as pressure, temperature, environment, voltage.

晶圆键合机的基本原理是对需要键合的材料施加一系列的外部条件，比如压力、温度、环境、电压，不同的外部条件可以用来进行不同材料和结构的键合。

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Wafer bonder is divided into five subsystems: aeration system, vacuum system, high-voltage system, heating system, wafer transfer system. The five subsystems can provide the necessary external conditions for bonding.

晶圆键合机分为充气系统，真空系统，高压系统，加热系统，晶圆传送系统五个子系统，这五个子系统可为键合提供压力、环境、电压和温度等外部条件。

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Effect of water toughening temperature on microstructure and properties of super-high manganese steel with trace boron

水韧处理温度对含硼超高锰钢组织和性能的影响

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Calculation and Analysis for the Ms Temperature of Boron Steel

硼钢马氏体转变开始温度（Ms）的计算与分析

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3-D temperature field for C/ C composite braking discs

C/C复合材料飞机刹车盘的三维温度场

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Based on study of the energy dissipation of disc brake during the vehicle braking, the finite element model for analyzing the transient thermal field of the brake disc and brake pad during the urgent braking was established.

基于盘式制动器制动过程中能量耗散的研究，建立了紧急制动过程中制动盘与摩擦片瞬态温度场分析的有限元模型。

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Effect of Temperature on Crack Branching in Soda-Lime Glass Plates Subjected to Biaxial Flexure

温度对钠钙玻璃板在双向弯曲试验中裂纹分叉的影响

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Temperature Automatic Control System of PDC Braze Welding

复合片钎焊温度自动测控系统

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QJ301 is a copper-based brazing welding used solvent, the solvent particles uniformly fine at a temperature of850-1150 ℃, copper and brass brazing alloys gas welding or brazing flux when used.

QJ301是一种基于铜焊接用的铜焊溶剂，本溶剂颗粒均匀细微，在温度为850-1150℃，钎焊紫铜及黄铜合金气焊或钎焊时作助熔剂用。

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Electron beam brazing temperature field PID control system

电子束钎焊温度场PID控制系统

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The influence of brazing temperature and time on the wettability is significant.

钎焊温度和时间对润湿性有重要影响。

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However, the brazing temperature had little influence on the liquefying time.

而钎焊温度对中间层的液化时间没有明显的影响。

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Direct current electromagnet is extensively used as electromagnet controlling element. PTC element is a ceramic thermistor with positive temperature coefficient.

直流电磁铁是广泛应用的电磁控制元件，PTC元件是具有正温度系数特性的半导体陶瓷热敏电阻。

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