bonder的例句大全

This product design for IC assembly die attache process on die bonder machine.

本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计.

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Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备.

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The auto Die Bonder for SOT-23 transistor is a high-speed , high-precision, machinery electronics integrated equipment.

SOT-23晶体管封装自动键合机是 高速 、 高精度机电一体化精密设备.

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This product design for IC assembly die bonding process on die bonder machine.

本产品是为IC封装自动贴片机及其贴片工艺而设计.

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The device can replace the manual machine, and provide an equipment of varies die bonder.

该装置可取代手动装置, 为各种粘片机提供配套设备.

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The automatic wire bonder is one of the primary equipments in semiconductor back-end production.

自动金丝球焊机是半导体制造后端工序的关键设备之一,图像识别系统是其核心技术.

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Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.

基于解析模型的方法, 研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律.

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There is some additional function, such as generating reports from summary of bonder data.

还有一些附加的功能比如统计机台的各项参数然后生成报表.

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The X-Y table aquires the accuracy 5 μ m to ensure the exact positions of bonder spots.

X -Y工作台要求实现精度达5μm,以便保证各焊点的精确位置.

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To create new bonder business mode for new customer.

为新客户创建新的保税贸易模式.

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FAITH IS A STATE OF MIND WHICH MAY BE INDUCED BY AUTO-SUGGESTION beam tape automated bonder

自我暗示可以引发信心梁式引线带自动焊接器

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Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.

超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

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Ultrasonic transfer on horn of wire bonder

超声波在引线键合机变幅杆中的传递规律

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Finally, the two activated surfaces are joined together in an EVG 501 wafer bonder by applying a modest and uniform contact force at low temperatures, ensuring hermetic sealing of the cavities and preventing destruction or distortion of small features.

最终结果是，在EVG501晶圆键合机上，两个活化的表面在低温下通过施加一个适中的、均匀的接触压力而连接在一起，保证了空腔密封并防止了小结构的破坏和变形。

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Wafer bonder is divided into five subsystems: aeration system, vacuum system, high-voltage system, heating system, wafer transfer system. The five subsystems can provide the necessary external conditions for bonding.

晶圆键合机分为充气系统，真空系统，高压系统，加热系统，晶圆传送系统五个子系统，这五个子系统可为键合提供压力、环境、电压和温度等外部条件。

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The basic principle of Wafer bonder is to require bonding material applied a series of external conditions, such as pressure, temperature, environment, voltage.

晶圆键合机的基本原理是对需要键合的材料施加一系列的外部条件，比如压力、温度、环境、电压，不同的外部条件可以用来进行不同材料和结构的键合。

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Although manual gold wire bonder has been self-produced in our country, we realize automatic producing not yet, especially challenges still exist in the high speeding, high precision and stability.

虽然我国已能自行生产手动金丝球焊机，但尚未实现自动化，其中芯片定位和识别的实时性、高精度以及稳定性要求还面临着严峻挑战。

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Fundamental Principles and Methods of Ultrasonic Control in Wire Bonder

键合机中超声波的基本控制原理及方法

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Anti-jamming Design in Force Signal Acqusition System of Ultrasonic Al Wire Bonder

超声波铝线邦定机压力信号采集系统的抗干扰设计

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Model CL-ⅱ Ultrasonic Bonder

CL-Ⅱ型超声键合机

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