1、

Delamination caused by electrical-over-stress ( EOS ) and moisture expansion during reflow soldering have shown different delamination patterns.

由过电应力 ( EOS ) 和再流焊中的水汽膨胀引起的分层会显示出不同的失效模式.

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2、

Most wave energy propagates only in the composite plates up and below the delamination.

并且波的能量大部分在脱层处的上、下复合材料板中来回传播,被反射和透射出的能量很少.

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3、

The main wear mechanisms of the coating are abrasive wear and delamination wear.

涂层的磨损机制主要是磨粒磨损和剥层磨损.

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4、

Interfacial tractions at the broken ends will produce delamination.

断头处的界面引力将引起分层.

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5、

These inner and outer factors cause interface delamination, which is more serious in the density package.

这些内部和外部的因素直接导致了高密度芯片封装中粘结膜界面分层现象日趋严重.

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6、

Minimum adhesive strength build up ensures easy peeling without adhesive migration and delamination.

低逐加粘合度可确保易于剥离而不会产生溢胶和分离.

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7、

By the global-local method, the delamination study was implemented from mm scale to um scale.

通过“全局 - 局部”模拟方法, 将各向异性导电膜的界面分层研究从毫米级深入到亚微米级.

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8、

The additional state of axisymmetric delamination problem of sandwich plates is studied.

研究了夹芯板轴对称脱层问题的附加状态.

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9、

Mechanisms of delamination, void defects in electroless plating and nonuniformity in electroplate were introduced.

重点介绍了钻孔中分层 、 化学镀铜中的气泡缺陷、电镀中的镀层不均匀等缺陷产生的机理.

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10、

When the parallel and vertical cracks encountered plate-like particles detached by delamination mechanism.

平行和垂向裂纹相遇,导致片状颗粒按剥层机制脱落.

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11、

This model has a good reusability and expansibility by Standardizing interfaces and internal delamination.

通过规范接口与内部分层,使得该模块具有良好的可重用性和可扩展性.

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12、

The results show that main failure types of PDC well bits are gross fracturing and delamination.

结果表明,PDC钻头 切削齿的微断屑、宏观破裂及剥离失效形式是造成PDC钻头早期失效的主要形式和原因.

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13、

A refined delamination model for laminated composite beams is presented.

建立了一种精化的复合材料层合梁脱层模型.

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14、

In composite laminates there are four basic failure modes: matrix cracking, delamination, fiber breakage and debonding.

复合材料层合板中存在四种基本的失效模式,即: 基体开裂 、 分层 、 纤维断裂及脱粘.

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16、

Aerospace series - Cables, electrical, aircraft use - Test methods - Part 403 : delamination and blocking.

航空航天系列.飞行器用电缆.试验方法.第403部分:剥离和粘连

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17、

Analysis on Thermal-mechanical Stress and Moisture Driven Delamination in the QFN Package Devices

热–机械应力和湿气引起QFN器件层间开裂分析

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18、

Study on Interface Delamination of QFN under Thermal Shock Loading Based on CZM Method

基于CZM法QFN器件热冲击载荷下的界面脱层研究

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19、

It is shown that the compliance method for determining the delamination size in DCLS specimens is not only convenient and practical but also accurate.

结果表明,用柔度法测定DCLS试样的分层尺寸,不仅测量结果准确,而且简单易行,避免了光测法的诸多麻烦和精度低的缺点。

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20、

Through the delamination mapping among these features, the nonfigurative requirement can be transformed into 3D structure shapes and constraints. After that, generalized Boolean operation is used to build the detail part model with the constraints.

通过功能需求与应用特征间的分层映射关系将概念化的需求特征转化为具体的结构形状和约束,进而利用广义布尔运算将映射后的特征根据约束关系进行具体零件结构建模。

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