delamination

Mechanisms of delamination, void defects in electroless plating and nonuniformity in electroplate were introduced.

重点介绍了钻孔中分层 、 化学镀铜中的气泡缺陷、电镀中的镀层不均匀等缺陷产生的机理.

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Delamination caused by electrical-over-stress ( EOS ) and moisture expansion during reflow soldering have shown different delamination patterns.

由过电应力 ( EOS ) 和再流焊中的水汽膨胀引起的分层会显示出不同的失效模式.

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Interfacial tractions at the broken ends will produce delamination.

断头处的界面引力将引起分层.

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The main wear mechanisms of the coating are abrasive wear and delamination wear.

涂层的磨损机制主要是磨粒磨损和剥层磨损.

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This model has a good reusability and expansibility by Standardizing interfaces and internal delamination.

通过规范接口与内部分层,使得该模块具有良好的可重用性和可扩展性.

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In composite laminates there are four basic failure modes: matrix cracking, delamination, fiber breakage and debonding.

复合材料层合板中存在四种基本的失效模式,即: 基体开裂 、 分层 、 纤维断裂及脱粘.

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Most wave energy propagates only in the composite plates up and below the delamination.

并且波的能量大部分在脱层处的上、下复合材料板中来回传播,被反射和透射出的能量很少.

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The results show that main failure types of PDC well bits are gross fracturing and delamination.

结果表明,PDC钻头 切削齿的微断屑、宏观破裂及剥离失效形式是造成PDC钻头早期失效的主要形式和原因.

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Minimum adhesive strength build up ensures easy peeling without adhesive migration and delamination.

低逐加粘合度可确保易于剥离而不会产生溢胶和分离.

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When the parallel and vertical cracks encountered plate-like particles detached by delamination mechanism.

平行和垂向裂纹相遇,导致片状颗粒按剥层机制脱落.

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By the global-local method, the delamination study was implemented from mm scale to um scale.

通过“全局 - 局部”模拟方法, 将各向异性导电膜的界面分层研究从毫米级深入到亚微米级.

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A refined delamination model for laminated composite beams is presented.

建立了一种精化的复合材料层合梁脱层模型.

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These inner and outer factors cause interface delamination, which is more serious in the density package.

这些内部和外部的因素直接导致了高密度芯片封装中粘结膜界面分层现象日趋严重.

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The additional state of axisymmetric delamination problem of sandwich plates is studied.

研究了夹芯板轴对称脱层问题的附加状态.

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