1、

Blind joint detection for TD-SCDMA System based on parallel factor technique is investigated in this paper.

本文研究了TD-SCDMA系统中基于平行因子技术的盲联合检测。

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2、

A novel blind joint angle and delay estimation method in uniform circular array based on trilinear model was presented.

提出了均匀圆阵中一种盲联合角度和时延的估计方法(BJADE)。

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3、

A novel blind joint angle and delay estimation method based on trilinear model is presented. Oversampled signal of array antennas is processed by fast Fourier transform, and results show that the Fourier transformed signal has trilinear model characteristics.

提出一种新的盲联合角度-时延的估计方法,对阵列天线输出的过采样样本的Fourier变换后信号进行分析,结果表明,此信号具有三线性模型特征。

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4、

Blind recognition of joint multi-parameter OFDM signals based on high-order cumulants and trigonometric moments characteristics

基于高阶累积量和三角矩的联合多参数特征OFDM信号盲识别

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5、

3-D Finite Element Simulation of Bolted Flange Joint Considering Gasket Nonlinearity

考虑垫片非线性时法兰接头性能的三维有限元模拟

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6、

Behaviour of Bolted Joint in Timber; Structure and Design Formulae

木结构螺栓连接的承载能力&对国际标准化协会木结构设计规范螺栓连接计算公式的建议

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7、

Study on Energy Dissipation of Axial Vibration in Bolted Joint

螺栓连接接口轴向振动能量耗散特性研究

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8、

A Study on the Tangential Dynamic Characteristic Parameters of Bolted Joint

螺栓结合部切向动态特性参数的实验研究

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9、

Fatigue Design of Bolted Joint in a Steel Structure

金属结构中螺栓联接的疲劳设计

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10、

Nonlinear Model of Bolted Joint and Its Wave Energy Dissipation

螺栓接头非线性模型及其波能耗散

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11、

Strength studies on non-even distribution bolted joint in composite laminates

复合材料非均匀分布多钉连接强度研究

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12、

A Test Research on Fretting Damage of Bolted Joint and Its Coating Glue Protection

螺栓联接件的微动损伤及其涂胶防护试验研究

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13、

Results showed that the ductility of bolted splice joint is much better than that of the welded one;

试验结果表明:螺栓拼接节点的延性远好于梁柱焊缝连接;

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14、

In this study, effect of cyclic load on the vacuum tightness of the adhesively bonded joint was investigated experimentally.

该文实验研究了循环载荷对粘接接头气密性的影响。

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15、

Review on residual thermal stress of ceramic bonded joint with metal

陶瓷与金属焊接接头残余热应力研究

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16、

Damage to the bonded joint if the waiting time is not observed before further work!

如不遵守等待时间而急于展开下一步工作,粘合处将受损!

provided by jukuu

17、

Effect of process parameters and interlayer on properties of 1420 Al-Li alloy diffusion bonded joint

1420铝锂合金扩散焊工艺及中间层材料对接头性能的影响

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18、

Effect of Alkaline Anodization Treatment of Durability of Titanium/ Epoxy Bonded Joint

碱性阳极化处理对钛合金/环氧胶接接头耐久性的影响

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19、

The results showed that the aging of epoxy bonded joint in water was accelerated by increasing temperature.

结果表明,提高温度可以加速环氧胶接接头在水中的老化;

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20、

Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.

超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

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