plating的例句大全

In the paper, the operation technology of electron beam evaporation plating Aluminium Chromium alloy coating is studied The optimum technology is obtained by discussing the influence of votage, current on auter appearance, adhesion inner Stress.

本文研究了电子束蒸发镀铝铬合金涂层的制备工艺，通过讨论不同的电压、束流对膜层外观、结合力、内应力的影响，确定了合适的陈镀工艺；

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By brush plating Ni-P-Al2O3-carbon nanotubes was deposited on the surface of metal, so that composite nano-materi-aals was obtained.

采用电刷镀的方法，在金属零件表面沉积一层Ni-P-Al2O3-碳纳米管复合材料。

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Current Research and Development of Brighteners for Silver Plating in Cyanide SoLution

氰化镀银光亮剂的研究现状及发展

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Electroless Nickel Plating with Alkyl Amine Boranes as Reductant

用烷基胺硼烷作还原剂化学镀镍

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Study on Ni-P Composite Plating of Heat Exchanger Units and Condensation Test Analysis

镍磷复合镀层换热元件制备工艺研究及凝结试验分析

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Hot dip zinc/ aluminum-plating is one of the most economic and effective protecting technologies in steels' corrosion protection in natural environment currently. However, molten zinc/ aluminum has strong corrosive nature on related equipments.

热浸镀锌／铝技术是目前防止钢铁材料在自然环境中腐蚀的最经济有效的防护技术之一，但熔融锌／铝液对热镀设备具有强烈的腐蚀作用。

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Gold plating process for electric coupler

电连接器镀金工艺

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The recovered sodium cyanide and sodium cuprous cyanide can be directly returned to the plating tank.

再生回收的氰化钠和铜氰化钠可直接在镀槽内回用。

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Error Analysis and Concentration control of Free Cyanide in Copper Plating Bath

氰化镀铜液中游离氰化钠的分析误差和含量控制

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The effect of pulse frequency and pulse duration ratio on the abrasion resistance of gold coatings is investigated with pulse plating in cyanide free and trace cyanide baths.

研究了脉冲电镀在微氰镀金，无氰镀金体系中脉冲频率、脉冲占空比对镀金层耐磨性的影响。

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The composition, binding power, electrical resistivity and corrosion resistance of plating were analysed.

对镀层进行了成分、结合力、电阻率和耐蚀性分析。

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In order to reduce the cost of electroless nickel plating, industrial chemicals were adopted.

为降低化学镀镍的成本, 采用工业级药品配制镀液.

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We have semiautomatic and automatic plating production line, so our output is large.

有半自动、全自动电镀生产线 、 具有较大的生产能力.

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Effect of Cu-plating Quality of Gas Shield Welding Wire on Its Rust Prevention Property

气保焊丝镀铜质量对其防锈性能的影响

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The plating solution has good brightening and leveling power at high and middle current density area and the permitted solution temperature is up to 40 ℃ better than that for the dye-type process.

该工艺中、高电流密度区光亮整平性好，允许液温可达40℃，优于染料型工艺。

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Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body.

以硼酸锌玻璃体为基础的高压二极管的电镀层的铅；

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The effect of bismuth sulfate content in plating bath and current density on current efficiency, bismuth content and morphology of obtained tin-bismuth alloy was studied.

研究了镀液中硫酸铋含量和电流密度对镀层铋含量、电流效率及镀层表面形貌的影响。

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A process of non-cyanide alkaline copper plating

无氰碱性镀铜清洁生产工艺的研究

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Non-cyanide alkaline copper plating

无氰碱性镀铜

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The practice proves that the three key points i.e. anode solubility, ability to prevent chemical replacement and covering power for the new process can meet the demand of continuous production in batches. Cyanide strike copper plating process can be replaced by the new process completely.

实践证明，该工艺在阳极溶解性、防化学置换及深镀能力这3个关键环节上达到大批量连续化生产的要求，完全可取代氰化预镀铜工艺。

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