wire的例句大全

The characteristic of copper clad aluminum bimetal wire ( for short CCA) are introduced, and the skin effect-the trait of CCA used in transmitting high frequency signal is analyzed.

介绍了铜包铝线的特点及其在高频信号传输中的集肤效应。

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The cup and cone-shaped fractures often occur when a high strength bimetal composite wire is drawn.

在高强度双金属复合导线的拉拔过程中，往往产生杯锥状断口的断裂形貌。

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By blending low-halogen flame-retarding agent with the basic resin and using γ irradiation FR-HDPE/ EPDM for cable and wire insulation with 125 ℃ heat resistance was prepared.

以HDPE和EPDM为基体，加入低卤阻燃剂，并经γ辐照，制备了耐温125℃的阻燃电缆绝缘材料。

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Analysis of Some Factors Improving Performance of Ultrasonic System in Wire Bonder

提高引线键合机超声系统性能的若干因素的分析

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Simulation Analysis and Experimental Study of Wire Bonder Precision Positioning Table

键合机精密工作台仿真分析与实验研究

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Software Analysis and Design of the Fully Automatic Gold Wire Bonder

全自动引线键合机系统软件分析与设计

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Study on the Vision Detection System of Automatic IC Wire Bonder

全自动晶片焊线机视觉检测系统的研究

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Anti-jamming Design in Force Signal Acqusition System of Ultrasonic Al Wire Bonder

超声波铝线邦定机压力信号采集系统的抗干扰设计

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Fundamental Principles and Methods of Ultrasonic Control in Wire Bonder

键合机中超声波的基本控制原理及方法

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Although manual gold wire bonder has been self-produced in our country, we realize automatic producing not yet, especially challenges still exist in the high speeding, high precision and stability.

虽然我国已能自行生产手动金丝球焊机，但尚未实现自动化，其中芯片定位和识别的实时性、高精度以及稳定性要求还面临着严峻挑战。

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Effect of bonding time on thick aluminum wire wedge bonding strength

键合时间对粗铝丝超声引线键合强度的影响

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Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength

平整度对细Al丝超声引线键合强度的影响

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Research Status of Reliability and Failure Mechanism of Ultrasonic Ball and Wedge Bonding With Copper Wire

Cu丝超声球焊及楔焊焊点可靠性及失效机理研究

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The influences of ultrasonic power on heavy aluminum wire wedge bonding strength were investigated.

超声功率是影响粗铝丝引线键合强度的最主要因素之一。

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Discussion of quality control of gold wire ball bonding

金丝球焊质量控制的探讨

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Development of these work is of benefit to raising quality of gold wire ball bonding.

这些工作的开展有利于提高金丝球焊的焊接质量。

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Study on the Technology of High Density Gold wire Ball Bonding under Normal Temperature

高密度常温金丝球焊接技术探讨

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Fracture Analysis of Ball Bonding Gold Wire and the Way to Improve Processing Function

球焊金丝产生断裂的原因及改善加工性能的途径

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Contrast Research on the Reliability of Gold and Copper Wire/ Ball Bonding

金、铜丝球键合焊点的可靠性对比研究

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Study on the Preparation and Ball Bonding Process for the High-Performance Copper Bonding Wire

高性能键合铜丝的制备及其球键合工艺研究

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