The influence of junction area and bonding pad size on the dark current has been also analyzed.

1、

New Type Roller Contour of Bonding Pad Roll for SSAW Pipe Unit

新型螺旋焊管机组焊垫辊辊型

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2、

It turns out that the antibonding orbital is a little bit higher from the atomic orbital level than the bonding orbital is lower.

这证明了，反键轨道，比原子轨道高，成键轨道比原子轨道第。

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3、

The valence bonding orbital rules in polyacids

多酸的价成键轨道规则

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4、

The Map Analysis of Bonding orbital Wave Function of Fe-Mo-S Cluster the Analogue of the Nitrogenase Fe-Mo-Cofactor

固氮酶Fe-Mo辅基模拟物Fe-Mo-S原子簇成键轨道的波函数图形分析

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5、

And what you find is when you have a bonding orbital, the energy decreases compared to the atomic orbitals.

你们发现当你有个成键轨道的时候，相比原子轨道能量要降低。

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6、

And so this lower level is called a bonding orbital, and it is a bonding molecular orbital.

所以能级较低的轨道叫做成键轨道，这就是成键分子轨道。

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7、

And this again is what we're going to call a bonding orbital.

同样，我们叫它成键轨道。

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8、

So, let's start our discussion of a bonding orbital.

让我们开始来讨论成键轨道。

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9、

Finally, the two activated surfaces are joined together in an EVG 501 wafer bonder by applying a modest and uniform contact force at low temperatures, ensuring hermetic sealing of the cavities and preventing destruction or distortion of small features.

最终结果是，在EVG501晶圆键合机上，两个活化的表面在低温下通过施加一个适中的、均匀的接触压力而连接在一起，保证了空腔密封并防止了小结构的破坏和变形。

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10、

Wafer bonder is divided into five subsystems: aeration system, vacuum system, high-voltage system, heating system, wafer transfer system. The five subsystems can provide the necessary external conditions for bonding.

晶圆键合机分为充气系统，真空系统，高压系统，加热系统，晶圆传送系统五个子系统，这五个子系统可为键合提供压力、环境、电压和温度等外部条件。

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11、

The basic principle of Wafer bonder is to require bonding material applied a series of external conditions, such as pressure, temperature, environment, voltage.

晶圆键合机的基本原理是对需要键合的材料施加一系列的外部条件，比如压力、温度、环境、电压，不同的外部条件可以用来进行不同材料和结构的键合。

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12、

Although manual gold wire bonder has been self-produced in our country, we realize automatic producing not yet, especially challenges still exist in the high speeding, high precision and stability.

虽然我国已能自行生产手动金丝球焊机，但尚未实现自动化，其中芯片定位和识别的实时性、高精度以及稳定性要求还面临着严峻挑战。

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13、

Fundamental Principles and Methods of Ultrasonic Control in Wire Bonder

键合机中超声波的基本控制原理及方法

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14、

Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.

超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

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15、

Anti-jamming Design in Force Signal Acqusition System of Ultrasonic Al Wire Bonder

超声波铝线邦定机压力信号采集系统的抗干扰设计

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16、

Model CL-ⅱ Ultrasonic Bonder

CL-Ⅱ型超声键合机

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17、

Study on the Vision Detection System of Automatic IC Wire Bonder

全自动晶片焊线机视觉检测系统的研究

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18、

Software Analysis and Design of the Fully Automatic Gold Wire Bonder

全自动引线键合机系统软件分析与设计

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19、

Simulation Analysis and Experimental Study of Wire Bonder Precision Positioning Table

键合机精密工作台仿真分析与实验研究

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20、

Analysis of Some Factors Improving Performance of Ultrasonic System in Wire Bonder

提高引线键合机超声系统性能的若干因素的分析

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