The Optimization Design of Wire Bonding Force Control System

1、

The Mechanism Formed the Bonding Force between New and Old Concrete

新老混凝土界面粘结力形成机理

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2、

And the content of chromate and polyvinyl alcohol also affect the bonding force between the coating and matrix.

涂液中铬酐和聚乙烯醇的含量还影响涂层与基体之间的结合力，必须适当控制。

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3、

Because it does not exist strong bonding force between alumina nitrate and calcium carbonate, the preparation of alumina tube with alumina nitrate using nano-calcium carbonate as template is not feasible in experimental conditions.

实验结果表明：由于纳米碳酸钙和硝酸铝之间不存在较强的结合力，所以在本文的工艺和实验条件下，以纳米碳酸钙为模板制备氧化铝空心管的方法是不可行的。

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4、

A high strength insulating brick with high alumina and low iron oxide has been developed by using floating particles and bonding clay as starting material with expanding agents, flux and combustible additives.

以漂珠、结合粘土为原料，加入膨胀剂、助熔剂和可燃加入物.可制得高强、高铝、低铁隔热耐火砖。

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5、

All these fulfil the quality requirement of electroceramics and the rectorite clay is a new-type bonding clay of electroceramics.

研究结果表明累托石粘土是一种新型的优质电瓷结合粘土。

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6、

Analyse the application of visual system in COG bonding machine.

针对视觉系统在全自动COG热压焊机中的应用进行分析。

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7、

The automatic position alignment system for the ultrasonic wire bonding machine

超声压焊机自动位置对准系统

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8、

Design of control system for the tape automatic bonding machine Based on PLC

基于PLC的TAB绑定机控制系统设计

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9、

Design of welding pressure control system for ultrasonic gold wire bonding machine

超声波金丝球焊线机焊接压力控制系统设计

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10、

Development of Control System Used in Ultrasonic Al Wire Bonding Machine

超声波铝线自动邦定机控制系统的研制

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11、

In order to enhance the welding speed of microcircuit chips, the control software algorithm for the bonding machine was optimized.

为了提高生产微电路芯片的焊接速度，我们对超声波焊接机工业控制软件的算法进行部分优化。

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12、

The control software for ultrasonic bonding machine is indispensable for the automatic production-lines run by manufactories making microcircuit chips.

超声波焊接机控制软件是国内外生产微电路芯片厂家自动化流水线的不可缺少的一部分。

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13、

Research on Bonding Layer of Transfer Foil Operation

转印箔中粘接层的研究

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14、

Impact of the chip bonding layer material on the thermal resistance of power LED

芯片键合层材料对功率型LED热阻的影响

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15、

Two dimensional finite element analysis of ceramic veneer bonding layer

对瓷贴面粘结层的有限元应力分析

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16、

The Distributed Force Model of Intelligent Beam Structures Based on Effect of Bonding Layer

考虑粘贴层影响的智能结构梁分布力模型

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17、

The capability variation rule of bonding layer was also analysed.

采用滑动磨损法检测了耐磨性，并分析了衬瓷层性能的变化规律。

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18、

Technique, such as electronic probe, XRD, optical microscope, micro-hardness and macro hardness test, are applied to investigate the microstructure, phase structure, and analyze the alloy element distribution of metallurgical bonding layer and the material mechanical property changes.

利用电子探针、XRD、光学显微镜、显微硬度和宏观硬度测试等手段，研究扩散件试样的显微组织、物相结构，分析冶金结合层中合金元素分布和材料内部力学性能变化。

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19、

TEM study of bonding layer in Cu-Al explosively welded joint

Cu－Al爆炸焊结合层的透射电镜研究

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20、

Study on the Preparation and Ball Bonding Process for the High-Performance Copper Bonding Wire

高性能键合铜丝的制备及其球键合工艺研究

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