1、

On the basis of the exploration of the wet etching technology in micro-machining ceramic materials, the excimer laser micro-machining technique is determined, by which batches of ceramic hotplates with different structural parameters are produced successfully.

在对湿法腐蚀微加工陶瓷材料工艺方法探索的基础上,确定了准分子激光微加工的技术路线,用该方法制作了不同结构参数的陶瓷微热板器件。

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2、

The photoresist sample prepared was evaluated by SEMATECH. Its best resolution is 0.1 μ m, the minimun exposure dose is 26 mJ/ cm2; it has not only excellent resolution and photosensitivity, but also good adhesiveness and anti-dry etching.

研制出的样品经美国SEMATECH实验室应用评价其最佳分辨率为0.1μm,最小曝光量为26mJ/cm2,不但具有优异的分辨率和光敏性,而且还具有良好的粘附性和抗干法腐蚀性。

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3、

Finally, discussed are etching mechanism, polishing principles, and control of reactive versions of the InP material.

文章最后讨论了InP材料的腐蚀机理 、 抛光原理及化学反应类型的控制.

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4、

This paper has Studied anisotropic etching mechanism of St in KOH scution by using collision theory.

本文应用碰撞理论研究了硅在KOH溶液中各向异性腐蚀的机理.

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5、

This paper investigated the law of KPB crystal twinning using microcrystallography, chemical etching and optical method.

本文采用显微结晶、化学浸蚀和光学方法研究了KPB晶体的孪生规律。

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6、

Characterization of etching of Al film and Si substrate with 10% tetramethylammonium hydroxide ( TMAH) has been done at a condition of adding various amount of Si dust.

研究了浓度为10%的四甲基氢氧化铵(TMAH)溶液,在不同量的Si粉掺杂下,对铝膜及硅衬底的腐蚀及其pH值的变化。

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7、

The Research and Analysis of the Roughness and Etching Rate in Forming Squre Silicon Cup with TMAH Solution

采用TMAH腐蚀液形成正方形硅杯的粗糙度与腐蚀速率的研究与分析

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8、

The anti-etching characterization of the films is carried out in KOH solutions and TMAH solutions at different temperatures.

本文比较了在不同温度条件下ABS胶膜在KOH和TMAH溶液中的抗腐蚀特性。

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9、

Big-size advertisement, Metal and Paper, Glass Etching , Plastic, Acrylic and.

大型广告物, 金属类、纸类 、 玻璃 、 塑胶, 丙烯酸的印刷.

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10、

The studies of n-type single crystal cadmium telluride based photoelectrochemical cell ( I) the surface etching and redox couple choosing

N型单晶碲化镉光电化学电池的研究&(Ⅰ)表面刻蚀与氧化还原偶选择

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11、

In the past, you will need a different process ( electro-mechanical engraving, etching ).

畴前则必要差别的工艺 ( 机电雕镂 、 化学蚀刻 ).

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12、

Resist : A coating used to inhibit the action of the acid when etching a printing plate.

抗蚀膜: 当腐蚀印版进,用来防止酸的腐蚀的涂层.

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13、

Another fast method of fabricating imprint stamp is using holographical lithography combined with ICP etching.

另外一种高效制备微纳米压印印章的方法是全息曝光结合感应耦合等离子体刻蚀(ICP)的方法。

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14、

The theory of ion etching and the parameter of ion source designing are discussed in detail.

并且详细论述离子刻蚀的原理以及离子源的参数设计.

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15、

Pseud Metal Etching Process by Printing UV Ink

UV仿金属蚀刻丝网印刷工艺的探讨

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16、

Pseud Metal Etching Process

仿金属蚀刻印刷工艺简介

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18、

Nowadays, in the manufacturing of microelectronic components fluorocarbon plasma was widely used in low K a-C: F: H film deposition and the etching of SiO_2, Si and other related materials.

目前,碳氟等离子体被广泛用在器件的微细加工过程中,如沉积低介电常数的氟化非晶碳薄膜,刻蚀SiO2、Si以及其它相关材料。

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19、

Shown as rigid PCB etching of the capacity copper wires.

图所示为刚性印制不活蚀刻的铜导线的载流量.

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20、

Use chemical etching method.

首先采用化学腐蚀法.

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