芯片的例句大全

Also this paper analyzes the power consumption of the chip, and analyses the switch tube conduction loss, switch loss, gate drive loss and rectifier diode losses in detail, and gives corresponding optimization scheme.

对芯片进行了功耗分析，重点分析了开关管的导通损耗、开关损耗、栅极驱动损耗以及整流二极管的损耗，并给出相应优化方案。

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We accomplished the full-chip static timing analysis of X microprocessor, and made a detailed analysis such as critical-path checking in the circuit.

参与并完成了X微处理器全芯片的静态时序分析工作，对电路的关键路径等重要信息进行了详细分析。

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At the same time, such codon usage principles as C G separation and G T base pairing were also considered. As a result, the number of probes was decreased to 4.25%.

然后进一步考虑密码子在编码时的CG选择性分离原则、GT配对原则，以进一步将芯片表面探针的数量减少至4.25%。

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At last, antenna effect and crosstalk effect are introduced, which badly influenced the function and property of the chip with deep sub-micron process.

深亚微米工艺设计的物理效应，介绍了天线效应和串扰效应，它们是影响芯片设计正确工作的基本保证。

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A borrowing binge by chip companies pushed debt-raising by tech companies to a previous peak in 2006, before a cyclical downturn.

此前，芯片公司的借贷热潮将科技公司的举债水平推上了2006年的顶峰，然后出现周期性低迷。

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Analysis and Design of Two-Phase DC-DC Converter Chip Current Sharing Circuit

双相DC-DC电源管理芯片均流控制电路的分析与设计

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To improve QoS, the chip has necessity to control the flow size and serving order of data streams in this process.

在处理的过程中，芯片需要控制数据流的流量大小和接受服务的顺序，以提高QoS。

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This paper is divided the chip circuit into point multiplication and point add double point and finite field operation module, and respectively the circuit optimization for three different operation on characteristics.

本文把芯片电路分为点乘模块、点加倍点模块和有限域运算模块，并且针对这三种模块的不同运算特点分别作了电路优化。

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The Design of High Frequency Fluorescent Lighting Ballasts IC

高频荧光灯镇流器芯片的设计

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The control chip controls the indicator light circuit and the button circuit through an I/ O port for realizing the function of man-machine switching.

控制芯片通过I/O口控制指示灯电路和按键电路，实现人机交换功能；

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Analysis on differential expression profile of cytochrome P450 genes in benzene poisoning cells using cDNA microarray

用cDNA微阵列芯片检测苯中毒细胞色素P450基因表达差异

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Firstly, by following 40V bipolar process the device can be inexpensive in cost and small in size.

首先采用40V双极型工艺可降低芯片的成本和面积；

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Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.

超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

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Although manual gold wire bonder has been self-produced in our country, we realize automatic producing not yet, especially challenges still exist in the high speeding, high precision and stability.

虽然我国已能自行生产手动金丝球焊机，但尚未实现自动化，其中芯片定位和识别的实时性、高精度以及稳定性要求还面临着严峻挑战。

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This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital Image Processing and Pattern Recognition.

介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。

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Research on the Ultrasonic Bonding Method for Polymer Microfluidic Chips

聚合物微流控芯片超声波键合方法研究

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Impact of the chip bonding layer material on the thermal resistance of power LED

芯片键合层材料对功率型LED热阻的影响

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The control software for ultrasonic bonding machine is indispensable for the automatic production-lines run by manufactories making microcircuit chips.

超声波焊接机控制软件是国内外生产微电路芯片厂家自动化流水线的不可缺少的一部分。

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In order to enhance the welding speed of microcircuit chips, the control software algorithm for the bonding machine was optimized.

为了提高生产微电路芯片的焊接速度，我们对超声波焊接机工业控制软件的算法进行部分优化。

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This paper describes the design and the test results of Gaussian frequency shift keying for bluetooth.

介绍了一种用于蓝牙芯片的高斯滤波移频键控的设计和测试结果。

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