solder的例句大全

Quality Inspection and Control Technology of CBGA Solder Ball On-line

CBGA植球在线质量检测与控制技术

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Less residue, shinny and clean solder spot.

残留物少，焊点光泽，干净。

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The ground solder for the Vrs.

地面焊料的越南难民.

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To form ( a joint ) in plumbing by spreading solder with a piece of cloth or leather.

拭接在管道工作时用一块布或皮来洒焊料来形成 ( 接头 )

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Used in the masking operation during wave solder process on PCB, prevented liquid immersing and polluting.

用于PCB板含浸过程中遮蔽金手指部分和防止电镀液浸入及污染.

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A : IPC is currently working to revise the specification for inspection of lead-free solder joints.

IPC 正在修订关于无铅焊接的质检标准.

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Important procedures for preparing a solder joint are graphically illustrated in this catalog on page 48.

焊料连接准备工作的重要步骤在本样本第48页中有图文并茂的描述.

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Solder surfaces and parts produced no white erythema shape residues, High surface insulation resistance.

焊锡面与零件面无白斑状残留物产生;高表面绝缘阻值.

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Fewer workers are needed to solder circuit boards.

焊接电路板需要的工人更少了。

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Manual solder equipment, hand Baptist tin heater Tool Grinder, hands and feet all aircraft.

手动焊锡设备, 手浸锡炉,磨刀机, 手推切脚机.

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Weld, braze, cement, solder and thread joints to join pipes and fabricate sections of piping system.

通过焊, 钎焊, 接合, 焊接和螺纹接头方式连接管道系统的管道和装配零件.

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And specific properties for several kinds of lead-free solder are analogized.

分析了几类正在实用化的无铅焊料特性.

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Application: Apply to all kinds of solder wire with lead or lead-free.

适用产品类型: 适用于各种含铅及无铅焊锡丝的拉伸.

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A number of metals and alloys, how ever , are difficult to silver-solder and require special procedures.

但是有许多金属和合金是难于银焊的,因此需要采用专门的工艺方法.

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Assembles pipe sections , tubing and fittings , using screws , bolts, solder, plastic solvent, and caulking.

用螺丝钉 、 栓 、 剂 、 胶溶剂及填塞,来装配水管零件、子及设备.

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The ameliorative conditions of the supersonic atomizing equipment of producing lead-free solder powder are found.

找出了无铅焊锡微粉工业生产设备要满足的基本条件.

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Solder end valves are limited by temperatures which affect the strength of the solder joint.

焊接连接端口阀门温度限制在不影响焊接连接端口的强度范围内.

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However, the composite layer material itself has a very complicated manufacturing process. As differences in manufacturers or production technology, solder thickness and uniformity will affect the heat transfer during brazing and solder flow, which create difficulties for the brazing process.

而复合层材料本身就是很复杂的制造过程，由于生产厂家或生产技术的差异，钎料层厚度及均匀度会影响钎焊时的传热与钎料的流动情况，为钎焊工艺带来困难。

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Rear-mounted designs are available with either solder cups or PCB solder pins.

后端安装设计可以使用防尘套或者PCB焊接钉.

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Nitrogen protection can improves wettability of lead-free solder and solder joint quality.

氮气保护可以改善无铅钎料的润湿性,提高焊点质量.

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