1、

No monitoring and control requirement on solder iron temperature.

对烙铁温度没有要求监测及控制.

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2、

Used with the solder wire together, soldering a stainless steel etc metal.

同锡线一起使用, 焊接不锈钢等难以上锡的金属.

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3、

Is the average and range of Solder Paste height measurements SPC controlled?

锡膏厚度测量的平均值和间距SPC是否受控?

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4、

The solder wire should attain the standard provision deflection and pitch by straightening.

焊丝经校直应达到标准规定的挺度和翘距.

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5、

Hand solder is recommended instead of reflow solder.

不建议使用回流焊,推荐使用手动焊接.

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6、

Titanium alloy solder bath : suitable for lead – free solder.

防腐蚀钛合金炉胆: 适用无铅工艺,寿命长. (先配项)

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7、

Solder paste, screen printing, use ways, printing process course will decide the printing quality.

在锡膏印刷工艺中,锡膏 、 丝印机 、 锡膏使用方法和印刷工艺过程将影响到印刷质量.

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8、

Influence of Cu on microstructure of soldered joint in Al brazing with rapid-solidifying Al-Cu solder

快速凝固Al-Cu钎料钎焊铝Cu对钎缝组织的影响

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9、

Use only with production equipment specifically designed for use with solder paste.

于专为锡膏设计的设备中使用.

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10、

The quality of solder joint affects the reliability of the products produced by SMT directly.

由表面组装技术(SMT) 形成的产品,其焊点质量直接影响到产品的可靠性.

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11、

Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint.

皂化剂中所含成分, 若不采用适当的抑制剂, 将会侵蚀金属表面, 造成焊点钝化.

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12、

Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling

CBGA结构热循环条件下无铅焊点的显微组织和断裂

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13、

A study on a module to solve the problem of the inefficiency of vacuum brazing with silver based solder.

针对多年来银基钎料真空钎焊效果不佳的问题,以一组件为例进行研究。

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14、

Study on vacuum brazing with silver based solder

银基钎料真空钎焊效果的研究

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15、

Application of Ag-Cu-P Brazing Solder with Negligible Content of Silver to a Electric Machine

Ag-Cu-P系列低银钎料在电机上应用

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16、

Development on High-frequency Induction Brazing Solder of Al/ 45 Steel

Al/45钢高频感应钎焊焊料的研制

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17、

Experimental Research on Torch Brazing Solder for Al-Cu Joint Welding

铝-铜火焰钎焊材料研究

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19、

The Study of Solder Bridge in Fine Pitch Devices

细间距器件焊点桥接研究

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20、

Modeling and Predicting of Solder Joint Shapes of Fine Pitch Technology

细微间距器件焊点形态成形建模与预测

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