1、

A special high-performance flux-cored solder shows its superiority in solder-ability and low corrosion.

本树脂芯焊锡丝具有极强的焊接能力和较低的腐蚀性.

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2、

This reference manual contains critical acceptance criteria for through-hole solder joints from the IPC-A-610 D.

此参考手册包括了《IPC-A-610D》内主要的镀通孔焊接可接受条件.

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3、

Strip steel but deep treatment is canal of cold belt, solder, cold curved bar to wait.

带钢可深加工为冷带 、 焊管 、 冷弯型钢等.

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4、

When joint is filled, a continuous run of solder or brazing alloy will be visible.

在安装连接部件时, 可以看到焊料和钎焊合金继续流动.

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5、

Tin-lead solder in the manufacture of professional audio equipment.

用于制造专业音响设备的铅锡焊料.

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6、

Joints between reinforcement members can be made satisfactorily with tin solder.

锡焊能够满意地做成加筋构件之间的接头.

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7、

An ideal connection that puts any solder to shame.

这种理想的连结方式,让其它各类接合方式瞠乎其后.

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8、

Single plated nickel barrier terminations has excellent solder heat resistance for soldering.

外部电极为镍的电镀构造,于焊接时具有极优越的耐热性.

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9、

Using tweezers, place the terminals of the unit on the solder paste print.

使用镊子, 把最终单位放到锡膏印上.

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10、

Nowadays, the approach to treating spent solder stripper includes neutralization, chemical sediment, electrolysis and so on.

目前, 废退锡液的处理方法有中和法 、 化学沉淀法 、 电解法,或用来制备三水合锡酸钡.

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11、

Depth of Solder Penetration drastically affects the breaking load of the joint.

是影响连接部分断裂负载能力的最主要因素。

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12、

Suit for reflow and wave flow solder.

适应再流焊与波峰焊.

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13、

Reflow solder paste in 2 hours as soon as possible after printing.

印刷后要在2小时内回流焊膏.

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14、

Compatible with infrared and vapor phase reflow solder process.

适用于回流焊接工艺.

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15、

In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.

表面贴装, 钢网是锡膏正确重复印刷的要害.

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16、

Familiar with assemble line, potting machine , wave solder machine and fixture.

熟悉流水线,黑胶机, 波峰焊设备和夹具.

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17、

Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects?

回流焊输出之板是否至少抽样检查板的置件精度, 有无少件和不良焊点?

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18、

As a result of repeated thermal cycling, fatigue cracks developed in the solder interconnects.

随着热循环周数的增加, 焊点中出现疲劳裂纹.

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19、

Thermal fatigue life of solder joints is predicted using the Coffin-Manson's empirical modified formula.

在此基础上,利用Coffin-Manson经验修正公式预报了焊点的热疲劳寿命.

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