焊的双语例句-焊造句-焊的相关例句-第11页-简答网英语词典

1、

Progress in backing weld technology for stainless steel tubes

不锈钢管打底焊接工艺的进展

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2、

The Development of An All-Position Automatic Welder with STT Technology for Pipe Backing Weld

STT全位置自动打底焊机的研制

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3、

Penetrant flaw detection agent was used to detect the backing weld surface, and the number of cracks was indicated by surface crack rate.

打底焊缝正面使用渗透探伤剂探伤，用表面裂纹率表示裂纹的数量。

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4、

Indirect Quirk Backing Weld of Thick-walled Vessel

厚壁容器的单面深槽打底焊

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5、

This paper describes the reasons for various kinds of defects of backing weld and their recognition on X_rays films It also introduces the protective measures for them

剖析带垫板焊缝中各种缺陷产生的原因及在射线底片上进行辨认的方法，并提出这些缺陷的防止措施

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6、

Study on the Vision Detection System of Automatic IC Wire Bonder

全自动晶片焊线机视觉检测系统的研究

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7、

Optimization design of welded bogie frame for high speed power car

高速动力车转向架焊接构架优化设计

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8、

Engineering method of evaluating fatigue strength for welded bogie frame

焊接转向架构架疲劳强度评定的工程方法

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9、

The production practice of quasi-boiling carbon electrode steel in concast

连铸准沸腾碳素焊条钢的生产实践

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10、

The result shows some cracks appearing on vertical weld connecting web plate of body bolster and draft sill as well as the part between web plate of body bolster and top cover plate.

试验结果表明，无中梁罐车存在枕梁腹板与牵引梁立焊缝裂纹及枕梁腹板与枕梁上盖板之间的裂纹。

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11、

Results showed that the ductility of bolted splice joint is much better than that of the welded one;

试验结果表明：螺栓拼接节点的延性远好于梁柱焊缝连接；

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12、

Review on residual thermal stress of ceramic bonded joint with metal

陶瓷与金属焊接接头残余热应力研究

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13、

Effect of process parameters and interlayer on properties of 1420 Al-Li alloy diffusion bonded joint

1420铝锂合金扩散焊工艺及中间层材料对接头性能的影响

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14、

This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital Image Processing and Pattern Recognition.

介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。

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15、

Explosive bonding for large thick stainless stell and billet

大型不锈钢/普碳钢厚板坯的爆炸焊接

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16、

TEM study of bonding layers in dissimilar alloy explosive bonding joints

异种金属爆炸焊结合层的电子显微镜研究

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17、

This phenomenon indicates that the strength of the IMC layers which connect the BGA and bonding pad is increased by adding nanoparticles.

这说明了钎料与焊盘连接处的IMC的强度在添加纳米颗粒后得到了明显的提高。

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18、

Since 1996, railway passenger car started to use the welded bogie to replace the original casting bogie, the corrosion was quite serious.

自1996年以来，铁路客车开始采用焊接转向架替代原铸造转向架，腐蚀情况相当严重。

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19、

In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.

文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。

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20、

Although manual gold wire bonder has been self-produced in our country, we realize automatic producing not yet, especially challenges still exist in the high speeding, high precision and stability.

虽然我国已能自行生产手动金丝球焊机，但尚未实现自动化，其中芯片定位和识别的实时性、高精度以及稳定性要求还面临着严峻挑战。

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