1、

Tag and steel are built in one, sealed into environmental friendly rosin, water-proof and anti-collision .

将电子标签与金属钢材一体成型, 并封装于环保树脂矽胶内, 防水、 防撞.

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2、

Microelectronic Package Technology of Striding Forward New Millenary

迈向新世纪的微电子封装技术

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3、

Based on the Intel X79 Express chipset, the board supports upcoming Sandy Bridge-E enthusiast processors in the LGA2011 package.

基于英特尔X79高速芯片组的主板支持即将在距桥的LGA2011封装-E的爱好者处理器。

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4、

Polymorphism is the third essential feature of an object-oriented programming language, after data abstraction and inheritance.

多态性是 面向对象 语言中继封装, 继承之后第三个基本特征.

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5、

The approaches to control bending fatigue of the leads to metallic packages were investigated systematically.

笔者系统地研究了改善金属封装外引线抗弯曲疲劳的方法.

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6、

The article discusses the calculation of mechanical properties of welded metal-bellows applied in mechanical seal devices.

本文主要讨论应用于机械密封装置中的焊接金属波纹管力学性能的计算.

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7、

C-UV 9911 is used for encapsulation of IC chips as glob top with excellent temperature cycling performance.

C-UV9911可用于IC芯片的球形封装并具有极佳的温度循环性能.

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8、

The accelerated test of a set of devices provides the time of vacuum maintenance.

对一批真空封装的器件进行了加速实验,得出了真空度保持的时间。

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9、

The data transferred between J2ME client and J2EE server are encrypted with Bouncy Castle and enveloped with XML format. By these ways, can client communicate with server more flexibly and safely.

在通信中利用Bouncy Castle加密库对传输数据加密并采用XML格式对其封装,使得移动客户端能够更好地与服务端进行安全会话。

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10、

Wire bonders is automatic semiconductor packaging equipment, which is composed of light, mechanical, electrical and control section, involving a number of areas, such as precision machinery, image recognition, intelligent motion control, computer application technology, optical and ultrasonic welding.

焊线机设备是一种由光、机械、电气、控制部分构成的自动化半导体封装设备,涉及精密机械、图像识别、智能运动控制、计算机应用技术、光学、超声波焊接等多个领域。

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11、

Lockheed Martin Astronautics has developed the Multifunctional Structure ( MFS) concept as a new system for space craft design that eliminates chassis, cables, connectors and folds the electronics into the walls of the spacecraft.

洛克希德·马丁宇航公司已开发出作为宇宙飞船设计新系统的多功能结构(MFS)概念,它淘汰了机箱、电缆、连接器并把电子设备封装进宇宙飞船的壁中。

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12、

Application, process control and solution of stored-energy welder in microelectronic packaging field are introduced.

储能焊机的工作原理及运用摘要:重要介绍储能焊机在微电子封装范畴的运用 、 工艺节制及解决法子.

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13、

This paper describes the technical lines of modularization and methods to realize particularizing and encapsulating modules during the simulation software design of control modules of I/ A series distributed control system.

介绍了I/A系列的集散控制系统控制模块仿真软件开发的模块化设计技术路线、模块的细化封装等一些基本问题的实现方法。

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14、

The encapsulation of a single conjugated molecule can have dramatic effects on the chemical stability and luminescence efficiency.

这种对单个共轭聚合物分子的封装可以有效提高其化学稳定性和发光效率。

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15、

Illustrate logical format and encapsulation method of Agent for communication and routing. Set work mode and dynamic protocol configuration method for Agent server.

给出用于实现通信和路由的Agent的逻辑格式和封装方法,并设置Agent服务器的工作模式和动态协议配置方法。

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16、

Improvement on Blanking Tube and Sealing Device of Baker

烘干机下料管和密封装置的改进

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17、

The parts which are encapsulated inside the shell comprise a blast blower, a suction pump, a membrane component and an aeration system.

封装于壳体内的各部件包括鼓风机、抽吸泵、膜组件和曝气系统。

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18、

Later, components and objects evolved allowing for the encapsulation of data ( member variables ) within them.

后来, 组件盒对象发掌起来,使数据可以封装在里面.

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19、

In summary, dry film photo-resist was applied to the wafer level high frequency flip-chip packaging process.

总结来说, 本文证实乾膜光阻适用于晶圆级高频 覆晶封装 制程.

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20、

With the object-oriented technology, an object is a single entity in which data and methods are capsulized. It can be used to represent knowledge or entities in simulated domain.

在面向对象技术中,对象能在单个实体中封装数据和操作(方法),并为知识和被模拟领域中的实体的表示提供条件。

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