1、

Research on an Encapsulation Method for the DAI in Grid Application

数据访问与集成的网格化封装方法研究

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2、

Solid state encapsulation technique of small volume high voltage power supply

小体积高压电源的固体封装技术

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3、

Research on encapsulation of service component based on service-oriented architecture

基于SOA的服务构件封装技术研究

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4、

Design of transfer mould and encapsulation technique for integrated circuit package

电子集成块封装工艺及传递模设计

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5、

Design and implement of motion control in auto encapsulation system

自动封装系统中运动控制的设计与实现

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6、

According to the practical application, simplify the standard RTP/ RTCP protocol. Under the premise of no more than the network MTU size, design different encapsulations.

根据实际运用对标准RTP/RTCP协议进行简化,在不超过网络MTU的前提下,对音视频数据设计了独自的RTP封装方式。

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7、

In this project, we use COM technology to seal and call the Database Model Layer.

本课题中以COM组件的形式封装和调用了数据库模型层组件.

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8、

A new seal device for floating roof storage tank

浮顶储罐的一种新型密封装置

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9、

Wire loop profile and its strain, which greatly affect the density and stability of IC packaging, are determined by the capillary trajectory.

IC引线键合中,键合头的运动轨迹决定着引线轮廓的形状和内部张力,影响着封装的密集度和稳定性。

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11、

Also we developed a new process for MCM finger attaching.

我们研究了一种MCM封装 连接端子焊接的工艺设计.

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12、

The envelopment of serial communication class under windows 9x

Windows9x下串行通讯类的封装

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13、

XML encapsulation& Embedding system command in the XML payload, such as through the CDATA tag.

XML封装&在XML负载中嵌入系统命令,如通过CDATA标记。

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14、

In which Brushless DC Motor module using C MEX S-function and some logic operation modules. To achieve the package of Brushless DC Motor.

其中在无刷直流电机模块采用C MEX S-函数结合一些逻辑运算模块,实现了对无刷直流电机本体的封装。

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15、

The main technical specifications of the equipment are the tank volume of 0.015 m3/ kWh and the vessel heat transfer area of 0.41 m2/ kWh.

结果新型立式封装板蓄冰设备的贮槽体积0.015m3/kWh,容器换热面积0.41m2/kWh。

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16、

Torco oil also contains MPZ additive package that reduce engine wear.

Torco石油还包含MPZ添加剂封装,减轻发动机磨损.

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17、

Implement IPQC and OQC on the assembly and test vendor.

按公司产品要求抽检封装及测试厂生产及发货质量.

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18、

Binary data can be embedded in XML by MIME encapsulation method.

采用MIME封装的方式可将二进制数据直接嵌入XML文档。

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19、

This paper discusses a true wafer level packaging ( WLP ) technology which is called Ultra CSPTM.

文章论述了超CSPTM圆片级封装技术工艺.

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20、

Eutectic furnace is a special equipment based on the eutectic principle, packaging chip according to different eutectic technological requirements of welding alloy materials under a vacuum or inert gas protection environment.

共晶炉就是基于共晶原理开发的专用设备,在真空或惰性保护气体环境中按照不同焊接合金材料的共晶工艺要求,完成芯片的封装。

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