封装的例句大全

Templates that encapsulate properties that are type lists model an MPL-compatible type sequence.

封装了类型列表属性的模板则依照MPL兼容的类型序列.

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Can get the main motherboard, CPU, card and other hardware information.

主要可以获取主板, CPU, 显卡等硬件信息.并封装成类便于调用和二次开发.

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The Trend of IDM Outsource and Opportunities for China Semiconductor Packaging & Testing Companies .

传统的 IDM 外包趋势与中国半导体封装产业的机遇?

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Polymorphism is the capability of something to assume different forms.

封装,是事物(对象)呈现不同形态的能力.

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The author introduced the properties of photosensitive packaging adhesive.

介绍了一种光敏封装胶的制备方法、性能及应用情况.

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It can also bond and package many kinds of photoconductive fiber communication apparatus.

可用于光纤通讯器件的粘接封装.

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Packaging a category, and detailed test code.

封装了一个类, 且有详细的测试代码.

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Package in 8 mm tape on 7 diameter reels.

封装在8毫米磁带7直径卷筒.

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The milk was sterilized and sealed in bottles.

牛奶经过灭菌处理后被封装在瓶子里。

《柯林斯高阶英汉双解学习词典》

Heat-sink and Package datum , Pad Spacing, Gap , Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据,衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的,未电镀引线.

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The stable 1.3μ m InGaAsP travelling-wave semiconductor optical Amplifier ( TW-SOA ) module is demonstrated in this paper.

报道一种具有稳定封装结构的1.3μmInGaAsP行波半导体光放大器.

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The fixed conventional wellhead sealing units which are often used today have no displacement adjustment function.

目前,使用较多的固定式常规型井口密封装置不具备调偏功能.

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Station 1-TR: Check top view marking.

站台1-封装: 检测顶视印记的质量.

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The coefficient of thermal expansion ( CTE ) is very important for studies of composite and thermo-mechanical analysis.

本文采用激光散斑干涉法测量微电子金属封装用金属复合 引线 的热膨胀系数.

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Study on Packaging Techology of Ultraviolet LED with High Efficiency and Reliability

高效率、高可靠性紫外LED封装技术研究

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The location even more special this year as IMAPS started here 40 years ago!

今年的研讨会地址也是国际微电子与封装协会40年来尤其特殊的一次.

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You could certainly model it the same way with Google's data store, but it would be more efficient to encapsulate the phone number as part of the user ( as a list or an array of phone numbers).

您完全可以按同样的方法用Google的数据存储建模，但将电话号码封装为用户的一部分（作为一个电话号码的列表或数组），效率会更高。

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Tag and steel are built in one, sealed into environmental friendly rosin, water-proof and anti-collision .

将电子标签与金属钢材一体成型, 并封装于环保树脂矽胶内, 防水、 防撞.

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Microelectronic Package Technology of Striding Forward New Millenary

迈向新世纪的微电子封装技术

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Based on the Intel X79 Express chipset, the board supports upcoming Sandy Bridge-E enthusiast processors in the LGA2011 package.

基于英特尔X79高速芯片组的主板支持即将在距桥的LGA2011封装-E的爱好者处理器。

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