Is the average and range of Solder Paste height measurements SPC controlled?
锡膏厚度测量的平均值和间距SPC是否受控?
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The second section will introduce the new slide valve and its application in Solder Paste process.
第二部分介绍最新的滑动阀科技及其在点锡膏中的应用.
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Used with the solder wire together, soldering a stainless steel etc metal.
同锡线一起使用, 焊接不锈钢等难以上锡的金属.
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Oxide occurring after melting approximately 50 % less than common solder.
熔解后氧化物(锡渣)之发生量较一般焊锡减低近半.
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Interface void damage is the failure characteristic of solder joint under temperature cycling.
温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度.
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If too much solder is used, it may flow past tube stop and clog sealing area.
如果使用的焊料太多, 那么有些焊料可能会流过管道阻挡部位,并堵塞密封区域.
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Is the time recorded when the solder paster is taken out from the storage case?
焊贴从存储环境取出时的时间是否有记录?
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So it will result in rigidity skin & block and solder balls etc.
产生的后果是:锡膏出现硬皮 、 硬块、难熔并产生大量锡球等.
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And techniques to make free solder bumping with electroplating are illustrated.
重点阐述了采用电镀制作无铅焊料凸点的方法.
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It's easy to learn to make a perfect solder joint when you use NIBCO Fittings.
如果使用美国尼伯科管件,很容易学会进行完美的焊料连接.
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理论模型也定量给出了焊膏厚度与焊点性能之间的关系.
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We should the adhibit of solder paste before screen printing by automatic machine or by hand.
我们在进行锡膏印刷前应对锡膏进行一定的检测.如果没有专用设备也可以用以下的方法检查一下.
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Do the supplies use magnifying glass to full check PCB solder connections?
供应商是否用放大镜全面检查PCB的焊点?
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